Lehigh University - MECHE: Herman F. Nied Publications

Herman F. Nied

Recent Book Chapters

P. F. Joseph, H. F. Nied, and A. C. Kaya, Problems in Mechanics and Applied Mathematics - A Collection of Papers by Fazil Erdogan, compiled on the occasion of the symposium, Problems in Mechanics and Applied Mathematics, Lehigh University, June 28 - 30. 1998.

Recent Journal Publications

Hummel, S. R., and Nied, H. F., “A Procedure for Measuring Biaxial Viscoelastic Behavior of Thermoplastics,” Experimental Mechanics, Vol. 44, No. 4, pp. 381 – 386, August 2004.

Yildirim, B., and Nied, H. F., “Residual Stresses and Distortion in Boiler Tube Panels with Welded Overlay Cladding,” ASME Journal of Pressure Vessel Technology, Vol. 126, pp. 426 – 431, November 2004.

Heffes, M. J., and Nied, H. F., “Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation,” ASME Journal of Electronic Packaging, Vol. 126, No. 1, pp. 135 – 141, 2004.

Nied, H. F., “Mechanics of Interface Fracture With Applications in Electronic Packaging,” Invited Paper, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 129 – 143, 2003.

Ayhan, A. O., and Nied, H. F., “Stress Intensity Factors for Three-Dimensional Surface Cracks using Enriched Finite Elements,” International Journal for Numerical Methods in Engineering, Vol. 54, Issue 6, pp. 899 – 921, 2002.

Park, J., Harlow, D. G., and Nied, H. F., "Growth Kinetics of Interfacial Damage: Epoxy Coating on a Generic Dual Inline Package," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, pp. 482 - 492, 2001.

DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied H. F., "Micromechanics of Deformation in Porous Liquid-Phase-Sintered Alumina under Hertzian Contact," Journal of the American Ceramic Society, 84, [8], pp. 1844 - 1850, 2001.

Ha, H.-C., Chan, H. M., and Nied, H. F., “Hertzian Contact Behavior of Alumina-Based Trilayer Composites: Experimental Observation and FEM Analysis,” Acta Materialia, 49, pp. 2453- 2461, 2001.

Park, J., Harlow, D. G., and Nied, H. F., “Characterization of Interfacial Adhesion Damage Induced by Accelerated Life Testing,” IEEE Transactions on Advanced Packaging, Vol. 23, No. 1, pp. 100 – 107, February 2000.

Bayram, Y. B., and Nied, H. F., “Enriched Finite Element – Penalty Function Method for Modeling Interface Cracks with Contact,” Engineering Fracture Mechanics, Vol. 65, No. 5, pp. 541 - 557, 2000.

Xu, A. Q., and Nied, H. F., "Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages," ASME Journal of Electronic Packaging, Vol. 122, pp. 301 - 305, 2000.

DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied, H. F., “Synergistic Effects of Porosity and Glass on Quasi-Ductility under Hertzian Contact in Liquid-Phase-Sintered Alumina,” Journal of the American Ceramic Society, 82 (3), pp. 749 – 752, 1999.

Ayhan, A. O., and Nied, H. F., “Finite Element Analysis of Interface Cracking in Semiconductor Packages,” IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 4, pp. 503 – 511, 1999.

Wang, C.-H., and Nied, H. F., "Temperature Optimization for Improved Thickness Control in Thermoforming," Journal of Materials Processing & Manufacturing Science, Vol. 8, No. 2, pp. 113 - 126, October 1999.

Recent Published Conference Proceedings

Herr, A. F., and Nied, H. F., “Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces,” Proceeding of ICF11, 11th International Conference on Fracture, Turin, Italy, CD-ROM, No. 5115, March 20-25, 2005.

Nied, H. F., “Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces,” FM2005, East China University of Science and Technology Press, ISBN 7-5628-1804-5, pp. 241 – 248, 2005.

Coulter, J. P., Nied, H. F., Smith, C. R., Angstadt, D. C., Cirucci, L., and Santoro, J., “Involving Middle School Students in Customer Focused Undergraduate Manufacturing Education,” Proceedings of the 2003 American Society for Engineering Education Annual Conference & Exposition, Nashville, TN, June 22 – 25, 2003.

Heffes, M. J., and Nied, H. F., “Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation,” IPACK2003-35346, Proceedings of the 2003 International Electronic Packaging Technical Conference and Exhibition, InterPACK’03, Maui, Hawaii, USA, ASME CD-ROM, ISBN 0-7918-3674-6, July 6 – 11, 2003.

Rungroungdouyboon, B., Coulter,, J. P., and Nied, H. F., “A Numerical Simulation of Non-Homogenous Sheet Heating During Thermoforming Processes,” JSME/ASME International Conference on Materials and Processing, Honolulu, HI, p. 385 – 390, October 15 – 18, 2002.

Nied, H. F., "Current Challenges for Improved Optimization and Control of Thermoforming Processes," Proceedings of the PPS-17, CD-ROM, file 374, The Polymer Processing Society, Seventeenth Annual Meeting, Montreal, Canada, pp. 1 - 17. May 21 - 24, 2001.

Ayhan, A. O., and Nied, H. F., “Analysis of Three-Dimensional Interface Cracking in Electronic Packages,” Advances in Fracture Research, Proceedings of ICF10, Editors: K. Ravi-Chandar, B. L. Karihaloo, T. Kishi, R. O. Ritchie, A. T. Yokobori Jr., T. Yokobori, ICF100832OR, Elsevier Science CD-ROM, ISBN 0080440428, December 2001.

Wang, C.-H., and Nied, H. F., "A Numerical Solution of the Inverse Problem for Thermoforming Processes Using Finite Element Analysis," CAE and Related Innovations for Polymer Processing, edited by Turng, L. S., Wang, H. P., Ramani, K., and Benard, A., , ASME publication MD-Vol. 90, pp. 245 - 256, 2000 ASME IMEC&E, Orlando, FL, November 5 -10, 2000.

Ayhan, A. O., and Nied, H. F., “Finite Element Modeling of Crack Interactions with Solder Balls,” Proceedings of SEM IX International Congress on Experimental Mechanics, pp. 889 - 894, Orlando, FL, June 5 – 8, 2000.

Wang, C. H., and Nied, H. F., “Solution of Inverse Thermoforming Problems Using Finite Element Simulation,” ANTEC 2000 – Proceedings of the 58th Annual Technical Conference & Exhibition, Vol. XLVI, Orlando, Fl., pp. 768 - 772, Society of Plastics Engineers, May 7 - 11, 2000.

Pearson, R. A., Ayhan, A., and Nied, H. F., “Modeling the Mechanical Behavior of Underfill Resins and Predicting Their Performance in Flip-Chip Assemblies,” IMAPS International Symposium on Advanced Packaging Materials 2000, pp. 57 – 63, March 6 – 8, 2000.

Nied, H. F., and Wang, C.-H, “Engineering Thermoplastics for Load Bearing Applications,” Proceedings of the 2000 NSF Design & Manufacturing Grantees Conference, Vancouver, BC, January 3 - 6, 2000. CD ROM, University of Washington, Seattle, WA.

Pearson, R. A., Lloyd, T. B., and Nied, H. F., “Fracture Behavior of Underfill Resins and Their Applications to Flip-Chip on Organic Substrate Assemblies,” EEP-Vol 26-2, Advances in Electronic Packaging – 1999 Volume 2, ASME, pp. 1749 – 1754, 1999.

Nied, H. F., “Engineering Thermoplastics for Load Bearing Applications,” 1999 NSF Design & Manufacturing Grantees Conference Proceedings, MPM-55, CD ROM, Long Beach, CA, January 5 – 8, 1999.

Wang, C.-H., and Nied, H. F., “Numerical Analysis of Thermoforming Processes,” Competing in a Global Manufacturing Environment, Proceedings 13th Conference with Industry, Lehigh University, pp. 31 – 43, May 24 – 25, 1999.

Recent Bulletins and Reports

Ozkan, U., Kaya, A. C., Loghin, A., Ayhan, A. O., and Nied, H. F., “Fracture Analysis of Cracks in Anisotropic Materials Using 3DFAS and ANSYS,” 2006GRC, Technical Information Series, Class 1 Report, January 2006.

Nied, H. F., Murugan, S., Ozturk, M., Nart, E., Mengel, A., Citirik, E., “Finite Element Modeling of Residual Stresses and Distortion in Stainless Steel Welded Structures,” Final Report, Project A-00.4, FY00, ONR Grant No. N00014-99-1-0887, Nonmagnetic Stainless Steel for Double Hull Ship Construction, ATLSS Report No. 04-06, Lehigh File No. 533610, March 31, 2004.

Nied, H. F., “Analysis of Conical Springs for Electric Switching Applications,” Lutron Electronics Company, September 2003.

Ozturk, M. and Nied, H. F., “A Parametric Design Analysis of Solder Joint Reliability for Ball Grid Array Assemblies,” Final Report, Visteon Technologies, May 2003.

Nied, H. F., “Sensitivity Analysis of Models for Large Scale Welded Structures,” ONR Stage 3 Progress Report, March 31, 2003.

Nied, H. F., and Sale, J. W., "Finite Element Analysis of Nozzle Outlet Stresses During Cold Start-Up of a High Pressure Steam Drum," ERC Report 01-400-06-06, March 2001.

Yildirim, B. and Nied, H. F., "Finite Element Simulation of Overlay Welding," ERC Report 00-500-05-20, August 2000.

Yildirim, B., and Nied, H. F., “Finite Element Analysis of Montour Station Burner Tip Units,” ERC Report, April 2000.

Nied, H. F., “Annual Grant Progress Report, CAREER: Engineering Thermoplastics for Load Bearing Applications,” March 2000.

Ayhan, A. O., and Nied, H. F., “Finite Element Analysis of Socket Weld,” Prepared for Duquesne Light, ERC Report 00-400-01-01, January, 2000.

Ayhan, A. O., and Nied, H. F., “Finite Element Analysis U-Bolt Hanger Supports,” Prepared for Duquesne Light, ERC Report 00-400-06-06, January, 2000.

Ayhan, A. O., and Nied, H. F., “FRAC3D – Finite Element Based Software for 3-D and Generalized Plane Strain Fracture Analysis (Second Revision), SRC Technical Report, October, 1999.

		Herman F. Nied Recent Book Chapters P. F. Joseph, H. F. Nied, and A. C. Kaya, Problems in Mechanics and Applied Mathematics - A Collection of Papers by Fazil Erdogan, compiled on the occasion of the symposium, Problems in Mechanics and Applied Mathematics, Lehigh University, June 28 - 30. 1998. Recent Journal Publications Hummel, S. R., and Nied, H. F., “A Procedure for Measuring Biaxial Viscoelastic Behavior of Thermoplastics,” Experimental Mechanics, Vol. 44, No. 4, pp. 381 – 386, August 2004. Yildirim, B., and Nied, H. F., “Residual Stresses and Distortion in Boiler Tube Panels with Welded Overlay Cladding,” ASME Journal of Pressure Vessel Technology, Vol. 126, pp. 426 – 431, November 2004. Heffes, M. J., and Nied, H. F., “Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation,” ASME Journal of Electronic Packaging, Vol. 126, No. 1, pp. 135 – 141, 2004. Nied, H. F., “Mechanics of Interface Fracture With Applications in Electronic Packaging,” Invited Paper, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 129 – 143, 2003. Ayhan, A. O., and Nied, H. F., “Stress Intensity Factors for Three-Dimensional Surface Cracks using Enriched Finite Elements,” International Journal for Numerical Methods in Engineering, Vol. 54, Issue 6, pp. 899 – 921, 2002. Park, J., Harlow, D. G., and Nied, H. F., "Growth Kinetics of Interfacial Damage: Epoxy Coating on a Generic Dual Inline Package," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 3, pp. 482 - 492, 2001. DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied H. F., "Micromechanics of Deformation in Porous Liquid-Phase-Sintered Alumina under Hertzian Contact," Journal of the American Ceramic Society, 84, [8], pp. 1844 - 1850, 2001. Ha, H.-C., Chan, H. M., and Nied, H. F., “Hertzian Contact Behavior of Alumina-Based Trilayer Composites: Experimental Observation and FEM Analysis,” Acta Materialia, 49, pp. 2453- 2461, 2001. Park, J., Harlow, D. G., and Nied, H. F., “Characterization of Interfacial Adhesion Damage Induced by Accelerated Life Testing,” IEEE Transactions on Advanced Packaging, Vol. 23, No. 1, pp. 100 – 107, February 2000. Bayram, Y. B., and Nied, H. F., “Enriched Finite Element – Penalty Function Method for Modeling Interface Cracks with Contact,” Engineering Fracture Mechanics, Vol. 65, No. 5, pp. 541 - 557, 2000. Xu, A. Q., and Nied, H. F., "Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages," ASME Journal of Electronic Packaging, Vol. 122, pp. 301 - 305, 2000. DiGiovanni, A. A., Chan, H. M., Harmer, M. P., and Nied, H. F., “Synergistic Effects of Porosity and Glass on Quasi-Ductility under Hertzian Contact in Liquid-Phase-Sintered Alumina,” Journal of the American Ceramic Society, 82 (3), pp. 749 – 752, 1999. Ayhan, A. O., and Nied, H. F., “Finite Element Analysis of Interface Cracking in Semiconductor Packages,” IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 4, pp. 503 – 511, 1999. Wang, C.-H., and Nied, H. F., "Temperature Optimization for Improved Thickness Control in Thermoforming," Journal of Materials Processing & Manufacturing Science, Vol. 8, No. 2, pp. 113 - 126, October 1999. Recent Published Conference Proceedings Herr, A. F., and Nied, H. F., “Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces,” Proceeding of ICF11, 11th International Conference on Fracture, Turin, Italy, CD-ROM, No. 5115, March 20-25, 2005. Nied, H. F., “Numerical Simulation of 3-D Mixed-Mode Crack Propagation on Bimaterial Interfaces,” FM2005, East China University of Science and Technology Press, ISBN 7-5628-1804-5, pp. 241 – 248, 2005. Coulter, J. P., Nied, H. F., Smith, C. R., Angstadt, D. C., Cirucci, L., and Santoro, J., “Involving Middle School Students in Customer Focused Undergraduate Manufacturing Education,” Proceedings of the 2003 American Society for Engineering Education Annual Conference & Exposition, Nashville, TN, June 22 – 25, 2003. Heffes, M. J., and Nied, H. F., “Analysis of Interfacial Cracking in Flip Chip Packages with Viscoplastic Solder Deformation,” IPACK2003-35346, Proceedings of the 2003 International Electronic Packaging Technical Conference and Exhibition, InterPACK’03, Maui, Hawaii, USA, ASME CD-ROM, ISBN 0-7918-3674-6, July 6 – 11, 2003. Rungroungdouyboon, B., Coulter,, J. P., and Nied, H. F., “A Numerical Simulation of Non-Homogenous Sheet Heating During Thermoforming Processes,” JSME/ASME International Conference on Materials and Processing, Honolulu, HI, p. 385 – 390, October 15 – 18, 2002. Nied, H. F., "Current Challenges for Improved Optimization and Control of Thermoforming Processes," Proceedings of the PPS-17, CD-ROM, file 374, The Polymer Processing Society, Seventeenth Annual Meeting, Montreal, Canada, pp. 1 - 17. May 21 - 24, 2001. Ayhan, A. O., and Nied, H. F., “Analysis of Three-Dimensional Interface Cracking in Electronic Packages,” Advances in Fracture Research, Proceedings of ICF10, Editors: K. Ravi-Chandar, B. L. Karihaloo, T. Kishi, R. O. Ritchie, A. T. Yokobori Jr., T. Yokobori, ICF100832OR, Elsevier Science CD-ROM, ISBN 0080440428, December 2001. Wang, C.-H., and Nied, H. F., "A Numerical Solution of the Inverse Problem for Thermoforming Processes Using Finite Element Analysis," CAE and Related Innovations for Polymer Processing, edited by Turng, L. S., Wang, H. P., Ramani, K., and Benard, A., , ASME publication MD-Vol. 90, pp. 245 - 256, 2000 ASME IMEC&E, Orlando, FL, November 5 -10, 2000. Ayhan, A. O., and Nied, H. F., “Finite Element Modeling of Crack Interactions with Solder Balls,” Proceedings of SEM IX International Congress on Experimental Mechanics, pp. 889 - 894, Orlando, FL, June 5 – 8, 2000. Wang, C. H., and Nied, H. F., “Solution of Inverse Thermoforming Problems Using Finite Element Simulation,” ANTEC 2000 – Proceedings of the 58th Annual Technical Conference & Exhibition, Vol. XLVI, Orlando, Fl., pp. 768 - 772, Society of Plastics Engineers, May 7 - 11, 2000. Pearson, R. A., Ayhan, A., and Nied, H. F., “Modeling the Mechanical Behavior of Underfill Resins and Predicting Their Performance in Flip-Chip Assemblies,” IMAPS International Symposium on Advanced Packaging Materials 2000, pp. 57 – 63, March 6 – 8, 2000. Nied, H. F., and Wang, C.-H, “Engineering Thermoplastics for Load Bearing Applications,” Proceedings of the 2000 NSF Design & Manufacturing Grantees Conference, Vancouver, BC, January 3 - 6, 2000. CD ROM, University of Washington, Seattle, WA. Pearson, R. A., Lloyd, T. B., and Nied, H. F., “Fracture Behavior of Underfill Resins and Their Applications to Flip-Chip on Organic Substrate Assemblies,” EEP-Vol 26-2, Advances in Electronic Packaging – 1999 Volume 2, ASME, pp. 1749 – 1754, 1999. Nied, H. F., “Engineering Thermoplastics for Load Bearing Applications,” 1999 NSF Design & Manufacturing Grantees Conference Proceedings, MPM-55, CD ROM, Long Beach, CA, January 5 – 8, 1999. Wang, C.-H., and Nied, H. F., “Numerical Analysis of Thermoforming Processes,” Competing in a Global Manufacturing Environment, Proceedings 13th Conference with Industry, Lehigh University, pp. 31 – 43, May 24 – 25, 1999. Recent Bulletins and Reports Ozkan, U., Kaya, A. C., Loghin, A., Ayhan, A. O., and Nied, H. F., “Fracture Analysis of Cracks in Anisotropic Materials Using 3DFAS and ANSYS,” 2006GRC, Technical Information Series, Class 1 Report, January 2006. Nied, H. F., Murugan, S., Ozturk, M., Nart, E., Mengel, A., Citirik, E., “Finite Element Modeling of Residual Stresses and Distortion in Stainless Steel Welded Structures,” Final Report, Project A-00.4, FY00, ONR Grant No. N00014-99-1-0887, Nonmagnetic Stainless Steel for Double Hull Ship Construction, ATLSS Report No. 04-06, Lehigh File No. 533610, March 31, 2004. Nied, H. F., “Analysis of Conical Springs for Electric Switching Applications,” Lutron Electronics Company, September 2003. Ozturk, M. and Nied, H. F., “A Parametric Design Analysis of Solder Joint Reliability for Ball Grid Array Assemblies,” Final Report, Visteon Technologies, May 2003. Nied, H. F., “Sensitivity Analysis of Models for Large Scale Welded Structures,” ONR Stage 3 Progress Report, March 31, 2003. Nied, H. F., and Sale, J. W., "Finite Element Analysis of Nozzle Outlet Stresses During Cold Start-Up of a High Pressure Steam Drum," ERC Report 01-400-06-06, March 2001. Yildirim, B. and Nied, H. F., "Finite Element Simulation of Overlay Welding," ERC Report 00-500-05-20, August 2000. Yildirim, B., and Nied, H. F., “Finite Element Analysis of Montour Station Burner Tip Units,” ERC Report, April 2000. Nied, H. F., “Annual Grant Progress Report, CAREER: Engineering Thermoplastics for Load Bearing Applications,” March 2000. Ayhan, A. O., and Nied, H. F., “Finite Element Analysis of Socket Weld,” Prepared for Duquesne Light, ERC Report 00-400-01-01, January, 2000. Ayhan, A. O., and Nied, H. F., “Finite Element Analysis U-Bolt Hanger Supports,” Prepared for Duquesne Light, ERC Report 00-400-06-06, January, 2000. Ayhan, A. O., and Nied, H. F., “FRAC3D – Finite Element Based Software for 3-D and Generalized Plane Strain Fracture Analysis (Second Revision), SRC Technical Report, October, 1999.