Lehigh University - MECHE: Arkady S. Voloshin Publications

Arkady S. Voloshin

J. Nouss, J. Ferfolja, U. Mohar, U. Florjani, A. Nikonov, A.Voloshin, I. Emri, “The Effect of Processing Conditions on Time-dependent Mechanical Properties of Extruded LDPE.” Proceedings of the 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2007, paper #379.

G.A. Arangio, V. Chopra, A. Voloshin and E. Salathe. “A biomechanical analysis of the effect of lateral column lengthening calcaneal osteotomy on the flat foot,”Clinical Biomechanics, 22(4), 472-477, 2007.

I. Emri, B. S. von Bernstorff and A. Voloshin, “A Simple Technique for Studying Shrinkage Dynamics of Fibers,” Experimental Mechanics, 46(6), 683-690, 2006.

L. Han, and A. Voloshin, “Reliability of Test Lands Targeting for Bed-of- Nails Style Test Fixture,” Chinese Journal of Mechanical Engineering, 19(1):151-155, 2006, ISSN:1000-9345.

L. Han, and A. Voloshin, “Reliability Analysis for Bed-of-nails Testing Fixture During Electrical Testing”, Chinese Journal of Scientific Instrument, 27(3), 224-236, 2006, ISSN:0254-3087.

G. Grossman, K. Wanninger, A. Voloshin, G. Oxfeld, and R.Martino, “Reliability and validity of goniometric turnout measurements compared with MRI and retroreflective markers.” 6th Annual Meeting of the International Association for Dance Medicine and Science, 2006.

A. Voloshin, “Bioengineering – A Natural Area for Multi-Disciplinary Education.” Proceedings of the Symposium on Multi-/Inter- Disciplinary Engineering Education, August 16-20, 2006, East China University of Science and Technology, Shanghai, China.

I. Emri, B. v. Bernstorff¬, and A. Voloshin, “Effect of Heating on Fiber Shrinkage.” Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2006, paper #23, Saint Louis, MO.

A. Voloshin, “Optical methods in characterization of time-dependent materials.” 10th International Workshop on Advances in Experimental Mechanics, Portoroz, Slovenia, Aug. 7-13, 2005.

L. Han, and A. Voloshin, “Reliability Study for Test Lands Targeting during Electrical Testing”, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’05), Shanghai, 46-52, June 2005.

L. Han, A. Voloshin, and R. Pearson, “Optical Measurements for Micro- and Opto-electronic Packages/Substrates”, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’05), Shanghai, 385-389, June 2005.

R. Reichenberg, Y. and A. Voloshin,” Effect of multiple power cycles on the in-plane deformation of the thermoelectric cooler.” Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 7-9, 2005, paper #359, Portland, OR.

A. Voloshin, “Effect of thermal loading on the deformations of the optoelectronic package -
A moiré interferometry approach.” Proceedings of SPIE, Volume 5595, 428-438, International Symposium on Optics East, Philadelphia, 25-28 October 2004.

R. Reichenberg, Y. Berlinsky, A. Voloshin and V. Gupta, “Analysis of the in-plane deformation of the thermoelectric cooler due to power cycling.” Abstracts of the Optoelectronics Devise Packaging Workshop, Bethlehem, PA, Oct 11-14, 2004.

A. Voloshin, “Deformation of the Thermoelectric Cooler – a Moire Interferometry Study.” Proceedings of the Proceedings of the 9th International Workshop on Advances in Experimental Mechanics, I.Emri, R. Cvelbar, and A. Nikonov, eds., ISBN 961-90575-9-7, Bled, Slovenia, Aug. 8-14, 2004.

L. Han, J. Zhong, and A. Voloshin, “Image Analysis and Data Processing of Time Series Fringe Pattern of PCBs by Using Moire Interferometry”, The 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’04), July 30 – July 3, 2004, pp: 141-145 　ISBN: 0-7803-8620-5

R. Reichenberg, A. Bar, and A. Voloshin, “Deformation Measurements of the Optoelectronic Packages.” Proceedings of the 2004 SEM X International Congress on Experimental Mechanics, June 7-10, 2004, paper #393, Costa Mesa, CA.

L. Han and A. Voloshin. “Statistical Analysis for Test Lands Positioning and PCB Deformation During Electrical Testing," Microelectronics Reliability, 44(5), 853-859, May 2004.

L. Han, A. Voloshin and I. Emri. “Study of the Multilayer PCB CTEs by Moiré Interferometry,” Optics & Lasers in Engineering, 42(6), 613-626. 2004.

W. Kim, A. S. Voloshin, and J. Tan, “Foot-Surface Cushioning Mechanism during Stance Phase of Running.” Proceeding of the International Congress on Sport Dynamics (ICSD2003), Sept. 1-3, 2003, Melbourne, Australia, “Sports Dynamics, Discovery and Application,” Edited by A. Subic, P. Trvailo, and F. Alam, RMIT University, Melbourne, Australia, 2003.

L. Han, A. Voloshin and I. Emri, “CTE Measurements of the PCB at Low Temperatures.” Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 250, Charlotte, NC.

T. Prodan, I. Emri, B. S. von Bernstorff, and A. Voloshin, “The Effect of Temperature on Morphology and Mechanical Behavior of PA.” Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 251, Charlotte, NC.

P.C. Hung and A.S. Voloshin. “In-Plane Strain Measurement by Digital Image Correlation,” Journal of the Brazilian Society of Mechanical Sciences and Engineering, XXV(3), 215-221, 2003.

		Arkady S. Voloshin J. Nouss, J. Ferfolja, U. Mohar, U. Florjani, A. Nikonov, A.Voloshin, I. Emri, “The Effect of Processing Conditions on Time-dependent Mechanical Properties of Extruded LDPE.” Proceedings of the 2007 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2007, paper #379. G.A. Arangio, V. Chopra, A. Voloshin and E. Salathe. “A biomechanical analysis of the effect of lateral column lengthening calcaneal osteotomy on the flat foot,”Clinical Biomechanics, 22(4), 472-477, 2007. I. Emri, B. S. von Bernstorff and A. Voloshin, “A Simple Technique for Studying Shrinkage Dynamics of Fibers,” Experimental Mechanics, 46(6), 683-690, 2006. L. Han, and A. Voloshin, “Reliability of Test Lands Targeting for Bed-of- Nails Style Test Fixture,” Chinese Journal of Mechanical Engineering, 19(1):151-155, 2006, ISSN:1000-9345. L. Han, and A. Voloshin, “Reliability Analysis for Bed-of-nails Testing Fixture During Electrical Testing”, Chinese Journal of Scientific Instrument, 27(3), 224-236, 2006, ISSN:0254-3087. G. Grossman, K. Wanninger, A. Voloshin, G. Oxfeld, and R.Martino, “Reliability and validity of goniometric turnout measurements compared with MRI and retroreflective markers.” 6th Annual Meeting of the International Association for Dance Medicine and Science, 2006. A. Voloshin, “Bioengineering – A Natural Area for Multi-Disciplinary Education.” Proceedings of the Symposium on Multi-/Inter- Disciplinary Engineering Education, August 16-20, 2006, East China University of Science and Technology, Shanghai, China. I. Emri, B. v. Bernstorff¬, and A. Voloshin, “Effect of Heating on Fiber Shrinkage.” Proceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 4-7, 2006, paper #23, Saint Louis, MO. A. Voloshin, “Optical methods in characterization of time-dependent materials.” 10th International Workshop on Advances in Experimental Mechanics, Portoroz, Slovenia, Aug. 7-13, 2005. L. Han, and A. Voloshin, “Reliability Study for Test Lands Targeting during Electrical Testing”, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’05), Shanghai, 46-52, June 2005. L. Han, A. Voloshin, and R. Pearson, “Optical Measurements for Micro- and Opto-electronic Packages/Substrates”, The 7th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’05), Shanghai, 385-389, June 2005. R. Reichenberg, Y. and A. Voloshin,” Effect of multiple power cycles on the in-plane deformation of the thermoelectric cooler.” Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, June 7-9, 2005, paper #359, Portland, OR. A. Voloshin, “Effect of thermal loading on the deformations of the optoelectronic package - A moiré interferometry approach.” Proceedings of SPIE, Volume 5595, 428-438, International Symposium on Optics East, Philadelphia, 25-28 October 2004. R. Reichenberg, Y. Berlinsky, A. Voloshin and V. Gupta, “Analysis of the in-plane deformation of the thermoelectric cooler due to power cycling.” Abstracts of the Optoelectronics Devise Packaging Workshop, Bethlehem, PA, Oct 11-14, 2004. A. Voloshin, “Deformation of the Thermoelectric Cooler – a Moire Interferometry Study.” Proceedings of the Proceedings of the 9th International Workshop on Advances in Experimental Mechanics, I.Emri, R. Cvelbar, and A. Nikonov, eds., ISBN 961-90575-9-7, Bled, Slovenia, Aug. 8-14, 2004. L. Han, J. Zhong, and A. Voloshin, “Image Analysis and Data Processing of Time Series Fringe Pattern of PCBs by Using Moire Interferometry”, The 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’04), July 30 – July 3, 2004, pp: 141-145 　ISBN: 0-7803-8620-5 R. Reichenberg, A. Bar, and A. Voloshin, “Deformation Measurements of the Optoelectronic Packages.” Proceedings of the 2004 SEM X International Congress on Experimental Mechanics, June 7-10, 2004, paper #393, Costa Mesa, CA. L. Han and A. Voloshin. “Statistical Analysis for Test Lands Positioning and PCB Deformation During Electrical Testing," Microelectronics Reliability, 44(5), 853-859, May 2004. L. Han, A. Voloshin and I. Emri. “Study of the Multilayer PCB CTEs by Moiré Interferometry,” Optics & Lasers in Engineering, 42(6), 613-626. 2004. W. Kim, A. S. Voloshin, and J. Tan, “Foot-Surface Cushioning Mechanism during Stance Phase of Running.” Proceeding of the International Congress on Sport Dynamics (ICSD2003), Sept. 1-3, 2003, Melbourne, Australia, “Sports Dynamics, Discovery and Application,” Edited by A. Subic, P. Trvailo, and F. Alam, RMIT University, Melbourne, Australia, 2003. L. Han, A. Voloshin and I. Emri, “CTE Measurements of the PCB at Low Temperatures.” Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 250, Charlotte, NC. T. Prodan, I. Emri, B. S. von Bernstorff, and A. Voloshin, “The Effect of Temperature on Morphology and Mechanical Behavior of PA.” Proceedings of the 2003 SEM Spring Conference on Experimental Mechanics, June 2-4, 2003, paper # 251, Charlotte, NC. P.C. Hung and A.S. Voloshin. “In-Plane Strain Measurement by Digital Image Correlation,” Journal of the Brazilian Society of Mechanical Sciences and Engineering, XXV(3), 215-221, 2003.